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Kinetic desctription of plasma. Influence of the various types of interactions on the electron energy distribution function. Low-temperature plasma in the discharges. Influnce of the various processes and composition. Plasma treatment of surfaces, thin films deposition. This lecture is determined for the doctoral study, in the odd years only.
Last update: T_KEVF (18.05.2005)
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The condition for completing the course is successfully passing the exam. Last update: Hrbek Tomáš, RNDr., Ph.D. (31.10.2025)
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1. Orazem, M. E., & Tribollet, B. (2017). Electrochemical Impedance Spectroscopy (2nd ed.). JOHN WILEY & SONS, INC.. ISBN 978-1-1185-2739-9
2. Bard, A. J., & Faulkner, L. R. (2000). Electrochemical Methods: Fundamentals and Applications (2nd ed.). New York, JOHN WILEY & SONS, INC.. ISBN: 978-0-471-04372-0
3. Lasia, A. (2014). Electrochemical Impedance Spectroscopy and its Applications. Springer New York, NY, ISBN 978-1-4614-8932-0 Last update: Hrbek Tomáš, RNDr., Ph.D. (31.10.2025)
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The exam is oral. The requirements for passing it correspond to the syllabus within the scope presented during the lectures. One question will be asked from each of the two thematic sections. Last update: Hrbek Tomáš, RNDr., Ph.D. (31.10.2025)
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1. Kinetic description of low-temperature plasma
Solution of the kinetic equation, Focker-Planck collision term. Influence of the elastic and non-elastic collisions on the electron energy distribution function. Influence of the elektron-electron collision. Maxwellian and non-Maxwellian distributions of electrons. Magnetic field influence. Collision frequency. 2. Low-temperature discharge plasma and its application in the technologies Plasma in dc and ac discharges. Influence of the diffusion, recombination, beta and gamma processes on these discharge behaviour. Processes near the electrodes. Influence of chemically active milieu on the plasma processes (e.g., electronegative gases, cataphoresis, tec.). Ions and neutral particle interactions with surfaces. Plasma surface treatment (cathode sputtering, etching, sterilisation, tec.). Thin film deposition, various influence on the film properties. Computational modelling in the plasma chemistry.
Last update: T_KEVF (18.05.2005)
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